1.23mm Spring Contact Titanium Copper Alloy EMC/RFI
Harwin 1.23mm spring contact in titanium copper alloy for EMC/RFI suppression. Reliable grounding and shielding for electronics.
This 1.23mm spring contact is manufactured from a high-performance titanium copper alloy and is designed specifically for EMC/RFI suppression. It provides a resilient grounding and shielding contact between a printed circuit board (PCB) and an enclosure, ensuring reliable electrical continuity and effective electromagnetic interference control.
The spring contact's dimensions are 43mm in height, 33mm in width, and 15mm in depth, and it weighs just 0.001 grams, making it a compact and lightweight solution for space-constrained electronic assemblies. Its robust construction ensures long-term durability and consistent performance in various operating conditions.
Key Features:
- Material: Titanium copper alloy for superior conductivity and strength
- Spring design provides reliable, resilient contact pressure
- Ideal for grounding and shielding applications
- Compact dimensions: 43mm (H) x 33mm (W) x 15mm (D)
- Ultra-lightweight: 0.001 grams
Applications:
- Perfect for use in electronic enclosures and chassis
- Suitable for PCB-to-enclosure grounding and shielding
- Effective for EMC/RFI suppression in sensitive electronic equipment
This spring contact is an essential component for ensuring electromagnetic compatibility in your electronic designs, providing a dependable and durable solution for grounding and shielding needs.
- Dispatched within 0-2 business days
- Delivery to United States: 3-5 business days*
- Free Shipping Included
Always follow local regulations and product guidance.
Free standard delivery on Canadian mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
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