
Bergquist Gap Pad 2500 0.040in thermal interface sheet (100 x 100mm). High conformability, 2.7W/m.K conductivity.
The Bergquist Gap Pad 2500 provides an effective thermal interface between heat sinks and electronic devices, particularly where uneven surface topography, air gaps, and rough surface textures are present. This non-reinforced pad is inherently tacky, making it ideal for applications requiring both high thermal performance and high conformability.
By eliminating air gaps, the pad significantly reduces thermal resistance, whilst its highly conformable nature minimises interfacial resistance. Additionally, it offers low-stress vibration dampening to protect components, and its design is fully compatible with automated dispensing equipment for efficient application.
Supplied in a convenient 100 x 100mm sheet, this thermal interface material is easy to handle and apply to various electronic assemblies. The filled silicone polymer construction ensures reliable and robust thermal management for your devices.
Key Features and Benefits
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