Bergquist Gap Pad Vo Soft Thermal Interface Sheet 100mm x 100mm

The Bergquist Gap Pad Vo Soft provides an effective thermal management solution, bridging the thermal interface between heat sinks and sensitive electronic components. Its primary function is to address common thermal challenges such as uneven surface topography, microscopic air gaps, and rough surface textures that can severely impede heat dissipation. By filling these voids, it significantly reduces thermal resistance, ensuring optimal heat transfer away from critical devices.

This soft, pliable sheet is specifically designed for low-stress applications and is ideal for use with fragile components that could be damaged by more rigid or high-pressure thermal pads. Its highly conformable nature allows it to mould perfectly to surface imperfections, minimising interfacial resistance and creating a uniform thermal pathway. This property is crucial for maintaining consistent operating temperatures and enhancing the reliability and longevity of electronic assemblies.

Key Features & Applications

• Eliminates Air Gaps: Compresses to fill voids, dramatically lowering thermal resistance for more efficient cooling.
• Highly Conformable: Adapts to uneven surfaces and rough textures, ensuring maximum surface contact and heat transfer.
• Low-Stress Vibration Dampening: Provides a cushioning effect that protects delicate components from mechanical stress and vibration.
• Process Compatibility: Formulated to be compatible with automated dispensing equipment, facilitating high-volume, precision application in manufacturing environments.
• Convenient Format: Supplied as a ready-to-use 100mm x 100mm sheet, easy to cut and shape for specific application requirements.

With a thermal conductivity of 0.8W/m.K, this Gap Pad is a reliable choice for managing heat in a wide range of electronics, from power supplies and LED assemblies to computing hardware and automotive ECU