BERGQUIST Gap Pad VOUS .08, 100 x 100mm

The BERGQUIST Gap Pad VOUS .08 provides a highly effective thermal interface between heat sinks and electronic devices. It is specifically engineered for applications where uneven surface topography, air gaps, and rough surface textures are present, ensuring optimal thermal management where it is needed most.

Featuring a highly conformable, gel-like modulus, this gap pad easily adapts to irregular surfaces, eliminating air gaps to significantly reduce thermal resistance. Its highly conformable nature also minimises interfacial resistance, whilst providing low-stress vibration dampening to protect delicate electronic components.

Key Features and Benefits

• Eliminates air gaps to reduce thermal resistance
• Highly conformable to reduce interfacial resistance
• Provides low-stress vibration dampening
• Compatible with automated dispensing equipment for efficient application
• Supplied in a convenient 100 x 100mm sheet

With a thermal conductivity of 1W/m.K, the BERGQUIST Gap Pad is an excellent choice for demanding electronic assemblies. Its compatibility with automated dispensing equipment makes it particularly suitable for high-volume manufacturing environments, ensuring consistent and reliable placement every time.