
BOYD aluminium heatsink with 10°C/W thermal resistance. Designed for TO-218, TO-220, and TO-247 packages. Features solderable tabs on 25.4mm centres.
The BOYD Aluminium Heatsink is expertly designed to provide efficient and reliable thermal management for a variety of semiconductor packages. With a thermal resistance of 10°C/W, this component effectively dissipates heat to help maintain optimal operating temperatures, ultimately prolonging the lifespan and reliability of your electronic devices.
Constructed from high-quality aluminium, the heatsink offers an excellent balance of superior thermal conductivity and a lightweight structure. It features practical solderable tabs with a 2.6mm diameter, which are conveniently positioned on 25.4mm fixing centres. This design allows for straightforward and secure mounting onto your circuit board or device assembly.
Key Specifications
This versatile heatsink is an essential component for ensuring reliable performance in power electronics and other heat-generating applications. Its compact form factor allows for seamless integration into space-constrained environments while providing robust and consistent cooling capabilities.
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