Molex / Brad 1mm Pitch Pico-Clasp Wire-to-Board Header, SMT, Vertical, 6 Way

The Molex / Brad 1mm Pitch Pico-Clasp Wire-to-Board Header is designed for high-density, space-conscious applications requiring a reliable fine-pitch connection. This surface-mount (SMT), single-row, vertical header integrates a positive locking mechanism to ensure a secure and stable connection between wire and board, preventing accidental disconnections in demanding environments.

Its compact 1mm pitch makes it ideal for modern electronic devices where board real estate is at a premium, such as in consumer electronics, telecommunications hardware, and portable medical devices. The vertical orientation facilitates straightforward board layout and efficient use of space within the assembly.

Key Features & Benefits

• 1mm Fine Pitch: Enables high-density interconnects, perfect for miniaturised electronic designs.
• Positive Lock Mechanism: Provides a secure, click-in-place connection that resists vibration and shock, enhancing overall system reliability.
• Surface-Mount Technology (SMT): Allows for automated assembly processes, reducing manufacturing time and costs while saving valuable board space compared to through-hole alternatives.
• Wire-to-Board Design: Creates a dependable interface for connecting discrete wires directly to a printed circuit board (PCB).
• Vertical, Single-Row Configuration: Offers a low-profile footprint ideal for applications with height restrictions or specific routing requirements.

This header is manufactured to the high-quality standards expected from Molex / Brad, ensuring consistent performance and durability. It is a critical component for engineers and designers looking to build compact, robust, and reliable electronic products.