
Multicomp Pro heatsink for TO-218, TO-220, TO-247. Low thermal resistance 2.7°C/W, black anodised, vertical mount.
The Multicomp Pro MC33271 is a compact, 25mm extruded aluminium heat sink designed for efficient thermal management in a wide range of electronic applications. Its black anodised finish not only provides a professional appearance but also enhances heat dissipation. The heat sink features solderable fixing pins and a notched base, with pre-drilled mounting holes for quick and secure installation.
With a low thermal resistance of just 2.7°C/W, this heat sink ensures effective heat transfer away from your components, maintaining optimal operating temperatures and improving system reliability. It is designed for vertical mounting and delivers high power dissipation, making it suitable for use with TO-218, TO-220, and TO-247 packages.
The MC33271 is a versatile cooling solution ideal for HVAC systems and other electronic equipment where reliable thermal management is critical. Its precision-extruded construction and quality materials ensure long-lasting performance.
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