
T GLOBAL gap filler sheet (0.5mm) with 1.6W/m.K thermal conductivity for heat dissipation in electronics.
The T GLOBAL L373S Gap Filler Sheet is a soft, highly compressible thermal interface material designed for efficient heat management in electronic assemblies. Its pliable nature ensures easy assembly and excellent conformity to uneven surfaces, providing reliable thermal conductivity of 1.6W/m.K to dissipate heat effectively from critical components.
This gap filler acts as a shock and vibration absorber, while also offering good electrical insulation, making it a versatile solution for a wide range of electronic devices. It is specifically used on ICs, CPUs, and MOS transistors, and for connections between boards and enclosure walls to aid heat conduction.
Key Benefits
Applications
Ideal for use in LEDs, motherboards, PSUs, TVs, PCs, hubs, handsets, and memory hard drives, this gap filler helps maintain optimal operating temperatures and enhance device reliability. Its design allows for efficient heat transfer from heat-generating components to heat sinks or enclosure walls, ensuring consistent performance. The product has a sheet thickness of 0.5mm and is part of the L373S range.
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