T GLOBAL L373S Gap Filler, Soft Thermal Pad, 150mm x 150mm

The T GLOBAL L373S Gap Filler is a highly versatile and compressible thermal interface material, designed to efficiently manage heat in a wide range of electronic applications. This soft pad provides excellent thermal conduction between components and their enclosures, ensuring optimal operating temperatures and enhanced device reliability.

Constructed from a pliable material, it is easy to assemble and offers superior electrical insulation, making it a safe choice for sensitive electronics. Its key function is to act as a shock and vibration absorber, protecting components from physical stress while simultaneously filling air gaps to improve heat dissipation.

Primary Applications

This thermal gap filler is specifically engineered for use on critical components such as ICs (Integrated Circuits), CPUs, and MOSFETs. It is ideal for creating a conductive bridge between circuit boards and enclosure walls, facilitating the transfer of heat away from vital parts. It is highly effective at dissipating heat from:

• LEDs and lighting modules
• Motherboards and PC components
• Power Supply Units (PSUs)
• Televisions and monitors
• Network hubs and switches
• Mobile handsets and communication devices
• Memory modules and hard drives

With a Shore hardness of just 5, this pad conforms easily to uneven surfaces, ensuring maximum contact and thermal efficiency without applying excessive pressure on delicate components. Its thermal conductivity rating of 1.6W/m.K provides a reliable path for heat flow, contributing to the longevity and stable performance of your electronic equipment.