WARTON Microprint P2010 No Clean Lead-Free Solder Paste, 40g Syringe
High-performance lead-free solder paste for PCB assembly. Halogen-free, slump-free & no-clean. 40g syringe format.
The WARTON Microprint P2010 No Clean Lead-Free Solder Paste is a high-performance solution designed for air and nitrogen reflow processes. Specially formulated to withstand higher processing temperatures required by SAC alloys, this solder paste ensures reliable, consistent performance across a variety of substrate materials, including Sn/Pb, Au/Ni, and OSP-treated finishes.
Key Features:
- Halogen-free composition, making it environmentally friendly and safer for workplace use.
- Slump-free with no solder balling, ensuring precise and clean solder joints.
- Compatible with both air and nitrogen reflow environments.
- Leaves clear probe-testable residue, facilitating easy inspection without residue interference.
- Provides excellent soldering performance with a 72-hour tack life, ensuring prolonged usability.
- 12-month refrigerated shelf life (when stored below 10°C), preserving product quality.
- Fast printing speed (20-100mm/sec), enhancing production efficiency.
- No clean formulation (ROM0 per J-STD-004), reducing post-soldering cleaning requirements.
Specifications:
- Flux Type: No Clean
- Solder Alloy Composition: Sn 96.5%, Ag 3%, Cu 0.5%
- Melting Temperature: 220°C
- Weight: 40g (auto syringe format).
Ideal for electronics assembly, PCB rework, and other high-precision soldering applications, this solder paste delivers superior performance while adhering to environmental and safety standards.
- Dispatched within 0-2 business days
- Delivery to United States: 3-5 business days*
- Free Shipping Included
- PCB assembly
- SMT (Surface Mount Technology) applications
- Reflow soldering processes
- Electronics manufacturing
- Halogen-free formulation
- Slump-free, no solder balling
- Suitable for air and nitrogen reflow
- Clear probe-testable residue
- 72-hour tack life
- 12-month refrigerated shelf life (<10°C storage)
- Print speed: 20-100mm/sec
- No clean (ROM0, J-STD-004)
- Solder alloy: Sn96.5/Ag3.0/Cu0.5
- Melting temperature: 220°C
- Weight: 40g
Always follow local regulations and product guidance.
Free standard delivery on Canadian mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
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