AMEC THERMASOL micro-porous ceramic heatsink (10x10x2mm). Non-conductive, low-profile cooling with pre-applied thermal tape.
Low-profile AMEC THERMASOL ceramic heatsink (15x15x2.5mm) with silicone tape. Non-conductive, high surface area for consumer electronics.
Compact ceramic heat sink 20x20x2.5mm with thermal tape. Low profile, non-conductive, large surface area for efficient cooling.
Low-profile 22x22x2.5mm micro-porous ceramic heatsink with thermal tape. Non-conductive, lightweight & ideal for consumer electronics.
Low-profile ceramic heatsink (30x30x5mm) with thermal tape. Non-conductive, lightweight & ideal for LEDs and compact electronics.
Micro-porous ceramic heatsink (50x50mm) for passive cooling. Non-conductive, 10W dissipation, with adhesive tape for ICs. 25g weight.
