ARIES 8-SOIC to 8-DIP IC Prototyping Adaptor

The ARIES 8-SOIC to 8-DIP IC Prototyping Adaptor is designed for rapid and easy prototyping, allowing you to seamlessly convert 8-SOIC (Small Outline Integrated Circuit) packages to a standard 8-DIP (Dual In-line Package) format. This adaptor is ideal for use with standard breadboards and breakout boards, streamlining your development and testing process.

Constructed with high-quality materials, the board features a 0.062-inch thick FR-4 substrate (UL94V-0) with 1/2oz copper traces for excellent signal integrity. The pin insulator is made from durable polyester (UL94V-0), while the pins themselves are crafted from 1/2-hard Brass 360 (UNS C36000 ASTM-B16-00) to ensure reliable connectivity. Additionally, the pins are finished with Au Flash plating, providing superior conductivity and corrosion resistance across a wide operating temperature range of -55°C to +125°C.

Key Specifications

• Convert From: 8-SOIC
• Convert To: 8-DIP
• Pitch Spacing: 2.54mm
• Row Pitch: 1.27mm
• Product Range: Correct-A-Chip

With compact dimensions of 43 mm in height, 33 mm in width, and 15 mm in depth, this robust adaptor is perfectly suited for industrial applications, providing a dependable interface for your integrated circuits during the design phase.