BERGQUIST TO-3P Thermal Pad, 43 x 33 x 15mm

The BERGQUIST TO-3P Thermal Pad is a high-quality thermal interface material specifically designed for TO-3P packages. Engineered to provide efficient heat dissipation, this thermal pad offers a thermal resistance of 0.45°C/W and a thermal conductivity of 0.9W/m.K, ensuring reliable performance for your electronic components.

A standout feature of this thermal pad is its electrically isolating property, providing isolation up to a minimum of 3.5kV. This makes it an ideal choice for applications where electrical insulation is crucial. The pad is clean, grease-free, and flexible, which simplifies the installation process and eliminates the mess often associated with thermal pastes.

Constructed from durable silicon rubber and fibreglass, the pad is built to withstand demanding environments. It operates effectively across a broad temperature range from -60°C to +180°C. With a thickness of just 0.18mm and a volume resistivity of 1ohm-cm, the BERGQUIST TO-3P Thermal Pad is a dependable solution for effective thermal management in compact electronic assemblies.