CIF No-Clean Lead-Free Solder Flux Paste for SMT, 10ml, 217°C

The CIF No-Clean Lead-Free Solder Flux Paste is a high-quality solder paste designed for Surface Mount Technology (SMT) applications. This solder paste is formulated with a metal alloy and flux, ensuring reliable performance for both wave and hand soldering. The alloy consists of rounded marbles (granulation size: 20–160µm), providing excellent control over deposit quantity, making it ideal for fine-pitch and thin-thread applications.

This Class-5 solder paste guarantees precision and consistency in deposition, which is crucial for advanced electronics manufacturing. Supplied in a convenient 10ml syringe, it allows for accurate point-to-point dispensing.

Key Features:

• Lead-Free Alloy Composition (96.5% Sn, 3% Ag, 0.5% Cu) – Compliant with environmental and safety regulations.
• No-Clean Flux (12% activity) – Reduces post-soldering residue, eliminating the need for cleaning.
• Optimal Melting Point (217°C) – Ensures strong and reliable solder joints without damaging sensitive components.
• Class-5 Granulation – Enables precise application for fine-pitch components and thin traces.

Perfect for electronics assembly, PCB prototyping, and repair work where precision and minimal post-process cleaning are essential. The CIF No-Clean Solder Paste provides a dependable, high-performance solution for professional and hobbyist soldering applications.