Multicomp Pro 1.27mm Pin Header, 2x20 Way, Vertical

The Multicomp Pro 1.27mm Pin Header is a compact and high-density interconnect solution, designed for modern electronic applications where board space is at a premium. Featuring a 2-row, 20-way vertical configuration with a 1.27mm (half-pitch) spacing, it enables efficient board-to-board and ribbon cable connections in a significantly smaller footprint than traditional 2.54mm headers.

This half-pitch header is engineered to save valuable real estate on printed circuit boards (PCBs), making it an ideal choice for densely packed designs in consumer electronics, telecommunications equipment, and compact computing devices. Its vertical orientation provides a reliable, perpendicular connection point, facilitating straightforward assembly and a clean, organised layout within the enclosure.

Constructed from durable materials with precision-machined pins, the header ensures secure mating and stable electrical connectivity. The compact design does not compromise on reliability, offering a robust interface for signal and low-power applications. It is supplied ready for through-hole soldering, providing a strong mechanical bond to the PCB for long-term durability.

Specifications

• Pitch: 1.27mm (Half-Pitch)
• Configuration: 2 Rows, 20 Ways (40 pins total)
• Orientation: Vertical
• Interface Type: Board-to-board and ribbon cable
• Key Feature: Saves space compared to standard 2.54mm headers
• Mounting: Through-hole
• Dimensions (LxWxH): 33mm x 15mm x 43mm
• Weight: 0.2 grams

Choosing the Multicomp Pro 1.27mm Pin Header means opting for a space-saving, high-quality interconnect that enhances the design flexibility and performance of your electronic projects.