Multicomp Pro DIL IC Socket, 14 Way, 0.3in Pitch, Turned Pin

The Multicomp Pro DIL IC Socket is a premium-grade component designed for reliable and secure integrated circuit (IC) mounting. It features a 14-way configuration with a 0.3-inch (7.62mm) row pitch, making it perfectly compatible with standard dual-in-line (DIL) packages. This socket ensures a robust and lasting electrical connection without the risk of heat damage from direct soldering, simplifying circuit prototyping, testing, and IC replacement.

Constructed with high-quality materials, the socket boasts beryllium copper contacts for excellent spring retention and conductivity, which are further enhanced with a gold plating. This gold-over-beryllium-copper construction provides superior corrosion resistance and ensures a low-contact resistance interface for stable signal integrity. The pins are of a turned pin design, offering improved solderability and mechanical strength for through-hole PCB mounting.

With a precise pitch spacing of 2.54mm between individual contacts, this socket guarantees accurate alignment with IC legs and PCB footprints. Its compact dimensions make it a space-efficient solution for a wide range of electronic projects, from hobbyist builds to professional development boards and industrial control systems. The durable housing securely holds the IC in place, preventing misalignment and connection issues.

Key Features & Specifications

• Contact Configuration: 14-way DIL (Dual-In-Line) socket.
• Contact Material: Beryllium copper for optimal performance and longevity.
• Contact Plating: Gold-plated contacts for enhanced conductivity and corrosion resistance.
• Pin Type: Turned pins for reliable through-hole soldering.
• Pitch Spacing: 2.54mm between contacts.
• Row Pitch: 7.62mm (0.3 inches).
• Dimensions (LxWxH): 33mm x 15mm x 43mm.
• Weight: 1.539 grams.

Ideal for use in breadboarding,