OXLEY SMD Ball & Socket Test Point Gold

The OXLEY PCB Surface Mount Ball and Socket Test Point is designed to provide accurate line tests during PCB assembly. Featuring gold-plated copper contacts and a silver socket finish, this test terminal ensures reliable and precise connectivity for test measurement applications.

A standout feature is its unique retention mechanism, which enhances reliability through low-stress contact. The high dispersion PTFE insulation offers excellent electrical isolation, while the gold test point finish guarantees consistent performance. This SMD test point is suitable for both hand and automatic assembly, offering exceptional versatility on the production line.

Engineered for efficiency, it boasts pick and place compatibility and a resilient kinematic design. With a low contact resistance of 2mΩ and a high insulation resistance of 10000MΩ, it is built for demanding environments. The test point operates effectively across a wide temperature range of -55°C to +125°C. It has compact dimensions of 43mm x 33mm x 15mm and a lightweight profile of just 0.1 grams, making it ideal for dense PCB layouts.