RF Solutions AI-WB2-12F-KIT WiFi Bluetooth Development Board, DIP 30, 49.66x25.

The RF Solutions AI-WB2-12F-KIT is a comprehensive development board kit designed for the advanced AI-WB2-12F Wi-Fi and Bluetooth module. This powerful kit provides everything needed to prototype and develop connected devices for the Internet of Things (IoT), smart home systems, mobile devices, and wearable electronics.

At the heart of the board is the AI-WB2-12F module, built around the capable BL602 chip. This core features a low-power 32-bit RISC CPU paired with 276KB RAM, enabling efficient processing for a wide range of applications. The module's DIP-30 package and on-board PCB antenna simplify integration into your projects, offering a compact footprint measuring 49.66mm x 25.40mm.

Connectivity & Features

This development board supports dual-mode wireless connectivity. It is compliant with Wi-Fi 802.11b/g/n protocols, supporting 20MHz bandwidth with a maximum data rate of 72.2Mbps and robust security including WPS, WEP, WPA, WPA2 Personal, WPA2 Enterprise, and WPA3. Simultaneously, it features Bluetooth Low Energy (BLE) 5.0 with mesh networking capabilities, allowing for flexible device communication. It supports various operational modes, including station + BLE and station + SoftAP + BLE.

Security & Peripherals

Security is a cornerstone of the design, featuring secure start-up with ECC-256 signature support for firmware mirroring. It includes advanced cryptographic hardware with an AES 128/192/256-bit encryption engine, SHA-1/224/256 hashing, and a true random number generator (TRNG). Additional security features include on-the-fly AES decryption for QSPI/SPI Flash in AES 128 CTR mode.

The board exposes a rich set of peripheral interfaces to interact with sensors and other components, including SDIO, SPI, UART, I2C, IR Remote, PWM, ADC, DAC, PIR, and multiple GPIOs. All essential Wi-Fi and Bluetooth components—MAC, baseband, radio frequency, power amplifier (PA), and low-noise amp（