RF Solutions Ai-WB2-13 WiFi & Bluetooth Development Board, DIP 30

The RF Solutions Ai-WB2-13-KIT is a powerful development board designed specifically for the Ai-WB2-13 Wi-Fi and Bluetooth module from Shenzhen Ai-Thinker Technology. At its core is the highly capable BL602 chip, a 32-bit RISC processor engineered for low power consumption, making it ideal for battery-operated IoT devices. The module supports dual-band Wi-Fi (802.11b/g/n) and the latest Bluetooth Low Energy (BLE) 5.0 protocol, including Bluetooth mesh networking, providing versatile connectivity options for a wide array of applications.

This compact board comes in a convenient DIP-30 package with an integrated on-board antenna, simplifying prototyping and integration into your projects. It offers robust Wi-Fi security with support for WPS, WEP, WPA, WPA2 Personal, WPA2 Enterprise, and WPA3, ensuring your connections remain protected. With support for a 20MHz bandwidth, it achieves a maximum data rate of 72.2 Mbps, facilitating efficient wireless communication.

Key Technical Features

• Core Processor: BL602 chip with 276KB RAM.
• Rich Peripheral Set: Includes SDIO, SPI, UART, I2C, IR remote, PWM, ADC, DAC, PIR, and numerous GPIOs for extensive sensor and actuator interfacing.
• Advanced Security: Features secure boot with ECC-256 signature, AES 128/192/256-bit hardware encryption engine, SHA-1/224/256, and a True Random Number Generator (TRNG).
• On-The-Fly Decryption: Supports QSPI/SPI Flash AES decryption in CTR mode.
• Operating Modes: Supports flexible network configurations including Station + BLE and Station + SoftAP + BLE modes.
• Fully Integrated: Contains integrated Wi-Fi MAC/BB/RF/PA/LNA and Bluetooth functionality.

With its comprehensive feature set and compact form factor, this development board is an excellent platform for innovators and engineers looking to develop connected solutions for the modern world.