Easily remove SMDs with Chip Quik's low-heat alloy kit, featuring flux, alcohol pads & instructions. Ideal for PCB repair.
Efficient leaded solder alloy (58°C melting point) for safe removal of SMD components during PCB repair & rework.
Precision no-clean tack flux syringe for PCB rework, BGA, and flip chip soldering. Non-corrosive and easy to clean.
Lead-free alloy for safe SMD removal. 16ft length, same quality as Chip Quik Removal Kit. Ideal for electronics repair.
Precision syringe with no-clean tack flux for BGA & flip chip soldering. Lead-free, non-conductive residue, 5cc volume.
Water-washable, no-clean tack flux syringe, ideal for PCB rework, BGA, and flip chip soldering applications.
CHIP QUIK no-clean solder paste syringe (10cc, T3 Mesh) for efficient, low-void, high-speed PCB soldering.
Precision no-clean solder paste (63Sn/37Pb, 183°C) in 10cc syringe—ideal for electronics repair & PCB assembly.
Convenient no-clean, lead-free solder paste in syringe for precision PCB assembly and repair. Sn96.5/Ag3/Cu0.5 alloy, 217°C melting point.
High-quality, lead-free solder paste in a 10cc syringe. Ideal for PCB assembly, SMT, and precision soldering.
Professional lead-free solder desolder rework kit by CHIP QUIK, housed in a durable plastic case for safe and efficient electronics repair.
Complete lead-free solder & desolder rework kit in a durable case. Ideal for circuit board repairs and electronics prototyping.
Low-temperature, lead-free solder paste (138°C) in 5cc syringe. No-clean flux, Sn42/Bi57.6/Ag0.4 alloy. Ideal for PCBs.
CHIP QUIK No Clean Tack Flux (8cc) – non-conductive, non-corrosive flux for soldering & desoldering, ideal for BGAs & flip-chips.
Professional no-clean tack flux for PCB repair - non-corrosive 2cc squeeze tubes (6-pack) compatible with all solder types.
Professional-grade leaded alloy for safe SMD removal. 4.5ft length, includes instructions - perfect for PCB rework.
Lead-free no-clean solder paste with 87% metal content. Ideal for PCB assembly and SMD work. 138°C melting point.
Lead-free, no-clean solder paste with Sn42/Bi57.6/Ag0.4 alloy. Ideal for precision PCB assembly, 60g T4 particle size.
Lead-free no-clean solder paste (Sn96.5/Ag3.0/Cu0.5) ideal for SMT, BGA & fine-pitch soldering.
Sn96.5/Ag3/Cu0.5 lead-free no-clean solder paste (60g, T4) - ideal for PCB assembly with minimal residue.
Non-flammable, water-washable liquid flux pen for leaded and lead-free soldering. Ideal for rework and repairs.
CHIP QUIK no-clean flux pen for leaded & lead-free soldering. Residue-free, safe, and easy-to-use for electronics work.
15ml no-clean, non-flammable liquid flux refill for soldering. Water-based, residue-free & safe for electronics.
30ml no-clean, water-based liquid flux for soldering. VOC-free, leaves no residue. Ideal for PCB rework.
