RF Solutions AI-WB2-12F-KIT WiFi Bluetooth Development Board DIP-30

The RF Solutions AI-WB2-12F-KIT WiFi Bluetooth Development Board is a Wi-Fi and Bluetooth development board built around the AI-WB2-12F module, providing a 49.66 mm x 25.40 mm platform for prototyping connected devices.

Overview

This development kit is designed for the AI-WB2-12F Wi-Fi and Bluetooth module and is intended for prototyping and developing connected devices for the Internet of Things (IoT), smart home systems, mobile devices, and wearable electronics. The module is built around the BL602 chip, which features a low-power 32-bit RISC CPU and 276 KB RAM. The DIP-30 package and on-board PCB antenna support straightforward integration into prototype projects.

Connectivity

The board supports dual-mode wireless connectivity. It is compliant with Wi-Fi 802.11b/g/n protocols, supporting 20 MHz bandwidth with a maximum data rate of 72.2 Mbps. Bluetooth Low Energy (BLE) 5.0 with mesh networking capabilities is also provided, and the module supports station + BLE and station + SoftAP + BLE operational modes.

Security

The module includes secure start-up with ECC-256 signature support for firmware mirroring, an AES 128/192/256-bit encryption engine, SHA-1/224/256 hashing, and a true random number generator (TRNG). On-the-fly AES decryption for QSPI/SPI Flash in AES 128 CTR mode is also supported.

Peripherals

A range of peripheral interfaces is available for interacting with sensors and other components, including:

• SDIO
• SPI
• UART
• I2C
• IR Remote
• PWM
• ADC
• DAC
• PIR
• Multiple GPIOs

Key Specifications

• Module: AI-WB2-12F
• Processor: BL602 chip with low-power 32-bit RISC CPU
• RAM: 276 KB
• Package: DIP-30
• Dimensions: 49.66 mm x 25.40 mm
• Weight: 50 g

Choose the RF Solutions AI-WB2-12F-KIT when you need a Wi-Fi and Bluetooth development board for prototyping connected devices with integrated security features and a broad peripheral set.