BOYD BGA Heat Sink with Thermal Pad - 23 x 23

The BOYD BGA Heat Sink with Thermal Pad provides efficient thermal management for surface-mounted BGA (Ball Grid Array) packages. Its tape-mounting design offers a significant advantage by eliminating the need for mounting holes, thereby saving valuable printed circuit board (PCB) real estate for other components. This feature is crucial for compact and densely packed electronic designs.

The heat sink utilises a pin-fin array structure, which is engineered to allow omni-directional airflow. This maximises convective heat dissipation, making it highly effective in a variety of orientations and airflow conditions commonly found in electronic enclosures. The assembly process is remarkably quick and clean thanks to the convenient peel-and-stick thermal adhesive pad, ensuring a secure bond without the mess or complexity of traditional thermal compounds or mechanical fasteners.

Crafted from lightweight aluminium, the heat sink offers an excellent balance of thermal conductivity and weight. The integrated thermal pad ensures optimal heat transfer from the BGA package to the heatsink fins, maintaining lower operating temperatures and enhancing the reliability and longevity of sensitive electronic components. This solution is ideal for applications where space is at a premium and reliable cooling is essential.

Key Features & Benefits:

• Space-Saving Design: Tape mounting eliminates drilling holes, preserving PCB area.
• Easy Installation: Peel-and-stick adhesive allows for fast, tool-free, and clean assembly.
• Efficient Cooling: Pin-fin array promotes effective heat dissipation with omni-directional airflow.
• Material: High-quality aluminium construction for optimal heat transfer.
• Application: Specifically designed for cooling BGA packages.

This component is a professional-grade thermal solution suitable for a wide range of electronics, from computer motherbоа

Variant Details

• Size: 23 x 23