
Bergquist Gap Pad 3000 S30 thermal interface sheet (0.08mm, 100x100mm). 3W/m·K conductivity for heat sinks & electronics.
The Bergquist Gap Pad 3000 S30 is an advanced thermal interface material designed to create an effective thermal bridge between heat sinks and electronic components. It is specifically engineered for applications where uneven surfaces, air gaps, or rough textures are present, ensuring optimal heat dissipation and device reliability.
This pad delivers ultra-high thermal performance while being highly conformable and glass reinforced. Its primary function is to eliminate insulating air gaps, which significantly reduces thermal resistance and improves overall cooling efficiency. The material's high conformability allows it to fill microscopic imperfections on surfaces, further minimising interfacial resistance for maximum heat transfer.
Key benefits include low-stress vibration dampening, which protects sensitive components from mechanical shock, and compatibility with automated dispensing equipment for high-volume, precision assembly. Supplied as a convenient 100mm x 100mm sheet, it offers excellent handling and ease of application in various manufacturing and prototyping environments.
Ideal for demanding electronics where thermal management is critical, the Gap Pad 3000 S30 ensures consistent performance, enhanced durability, and reliable thermal conductivity in compact and complex assemblies.
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