BERGQUIST Gap Pad, Non-Soft 0.06”, 100mm x 100mm Sheet

The BERGQUIST Gap Pad is a highly effective thermal interface material designed to manage heat dissipation in demanding electronic applications. It bridges the critical thermal path between heat sinks and electronic components, eliminating problematic air gaps that often arise from uneven surfaces, surface roughness, and irregular topographies. By conforming precisely to these imperfections, it dramatically reduces thermal resistance, ensuring efficient heat transfer away from sensitive devices.

This pad is characterised by its exceptional conformability, which minimises interfacial resistance for optimal thermal performance. It also provides valuable low-stress vibration dampening, protecting components from mechanical shocks. For streamlined production, the pad is compatible with automated dispensing equipment, facilitating quick and consistent application in high-volume manufacturing environments. Supplied as a convenient adhesive-backed sheet measuring 100mm x 100mm, it is ready for immediate use, simplifying the assembly process.

Key Features & Benefits:

• Eliminates Air Gaps: Fills microscopic voids and uneven surfaces to create a continuous thermal pathway, significantly lowering thermal resistance.
• Highly Conformable: Adapts to surface textures and topographies, ensuring maximum contact area and reducing interfacial resistance.
• Vibration Dampening: Provides low-stress cushioning to protect electronic components from shock and vibration.
• Production-Ready: Features an adhesive backing for easy installation and is compatible with automated dispensing systems for efficient assembly.
• Convenient Format: Supplied as a pre-cut 100mm x 100mm sheet for straightforward handling and application.