
Aluminium heatsink with 13°C/W thermal resistance, designed for TO-218/TO-220/TO-247 packages. Compact 43x33mm size.
The BOYD heatsink is a reliable thermal management solution designed to cool TO-218, TO-220, and TO-247 semiconductor packages effectively. With a thermal resistance of 13°C/W, this aluminium heatsink efficiently dissipates heat, ensuring optimal performance and longevity of your components.
Featuring solderable tabs with a 2.6mm diameter on 25.4mm fixing centres, this heatsink offers secure and straightforward installation. Its compact dimensions of 43mm x 33mm x 15mm make it suitable for a variety of electronic assemblies where space is at a premium.
The aluminium construction provides excellent thermal conductivity, while the component's functional design is unaffected by standard soldering or reflow processes, making it a dependable choice for professional and hobbyist projects alike.
Specifications
Always follow local regulations and product guidance.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
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