
Solderable slide-on heatsink for TO-220, 20°C/W, aluminium with tin-plated finish.
The BOYD PF750G is a solderable slide-on heatsink designed for TO-220 packages, featuring integrated tabs for secure and straightforward attachment. This non-electronic component is ideal for use in industrial applications where effective thermal management is required. Its design ensures that it remains functionally unaffected by normal soldering or reflow processes, making it a reliable choice for semiconductor circuits.
With a thermal resistance of 20°C/W, this heatsink efficiently dissipates heat to maintain optimal operating temperatures. It features a vertical mount orientation and a tin-plated finish, which not only enhances solderability but also provides a clean, professional appearance. The heatsink is constructed from high-quality aluminium, ensuring excellent thermal conductivity and durability.
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This heatsink is a practical and efficient solution for managing heat in electronic assemblies, ensuring reliable performance in demanding industrial environments.
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