Economical rosin flux desoldering braid for BGA pads & chips. 5.3mm width, static-safe bobbin, 1.5m length.
The Chemtronics Solder-Wick BGA Rosin Desoldering Braid is an effective and economical solution for precision desoldering tasks, specifically designed for BGA pads and chips. Its No Clean BGA Braid flux ensures quick and clean solder removal, minimising residue and rework time.
Engineered with optimised rosin flux content, this desoldering braid facilitates fast, thorough solder extraction without damaging circuit board surfaces or delicate components. The braid comes conveniently packed in dissipative bobbins for static protection and ease of handling, with each roll measuring 1.5m in length.
Ideal for electronics repair and PCB rework, this braid is a reliable choice for professionals seeking efficiency and cleanliness in solder removal. Purple labelled for easy identification, it combines performance with user convenience.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
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