CHIP QUIK Lead-Free Low Temp Solder Paste, Sn42/Bi57.6/Ag0.4, 50g
Low temp lead-free solder paste (138°C), 50g jar. Ideal for delicate components & PCB assembly. No-clean residue.
The CHIP QUIK Lead-Free Low Temperature Solder Paste provides a reliable and efficient soldering solution for delicate components, thanks to its low melting point of 138°C. This no-clean, thermally stable solder paste comes in a convenient 50g jar, making it ideal for professional and hobbyist applications alike.
Key advantages include reduced thermal damage to sensitive components, ensuring the longevity and reliability of your electronic assemblies. With printing speeds up to 125mm/sec and a long stencil life, this solder paste enhances productivity while maintaining high-quality results.
Features:
- Low melting temperature (138°C) for reduced heat exposure
- No-clean synthetic flux leaves clear residue
- Excellent wetting compatibility with most board finishes
- Low voiding for superior joint integrity
- Wide process window for versatile application
- Compatible with enclosed print heads
Specifications:
- Alloy Composition: Sn42/Bi57.6/Ag0.4
- Flux Type: Synthetic No Clean
- Melting Temperature: 138°C
- Weight: 50g
This solder paste is perfect for applications requiring precision and minimal thermal impact, such as in PCB assembly and repair work.
- PCB assembly and repair
- Delicate electronic components
- SMD applications
- Enclosed print head systems
- Alloy: Sn42/Bi57.6/Ag0.4
- Flux Type: Synthetic No Clean
- Melting Temperature: 138°C
- Weight: 50g
- Compatibility: Works with most board finishes
- Process Speed: Up to 125mm/sec
Always follow local regulations and product guidance. Use appropriate PPE.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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