CHIP QUIK No-Clean Lead-Free Low-Temp Solder Paste, 50g
CHIP QUIK low-temp solder paste (138°C) for delicate electronics. No-clean, lead-free, 50g jar. Ideal for PCB assembly.
The CHIP QUIK No-Clean Lead-Free Low Temperature Solder Paste is an advanced, user-friendly solution for delicate soldering tasks. This solder paste comes in a convenient 50g jar, making it perfect for both professional and hobbyist applications.
Its low melting point of 138°C ensures reduced thermal damage to sensitive components, allowing for lower heat settings during application. The paste offers excellent performance with printing speeds of up to 100mm/sec and provides a long stencil life, enhancing productivity.
Key Benefits:
- No-clean formulation leaves clear residues, minimising post-soldering cleanup.
- Excellent wetting compatibility with most board finishes ensures reliable solder joints.
- Low voiding results in strong, durable connections.
- Wide process window for versatile application.
- Shelf life: Over 6 months when refrigerated, and more than 2 months at room temperature.
Compatibility:
- Suitable for dispensing applications.
- Works seamlessly with enclosed print heads.
Ideal for: Precision soldering in electronics, PCB assembly, and rework where thermal sensitivity is a concern.
- Precision electronics soldering
- PCB assembly
- Rework and repair of delicate components
- Surface-mount technology (SMT) applications
- Flux Type: Synthetic No Clean
- Solder Alloy: 42% Sn, 57.6% Bi, 0.4% Ag
- Melting Temperature: 138°C
- Weight: 50g
- Shelf Life: >6 months (refrigerated), >2 months (unrefrigerated)
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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