CHIP QUIK No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip
Convenient no-clean, lead-free solder paste in syringe for precision PCB assembly and repair. Sn96.5/Ag3/Cu0.5 alloy, 217°C melting point.
The CHIP QUIK No-Clean Lead-Free Solder Paste Syringe offers a convenient and efficient solution for precision soldering applications. This solder paste comes in a ready-to-use syringe applicator, complete with a plunger and tip for easy dispensing. The no-clean formula ensures minimal residue, making it ideal for applications where post-soldering cleaning is not desired.
Key Features
- Printing speeds of up to 100mm/sec for high throughput applications.
- Long stencil life ensures durability and cost-effectiveness.
- Wide process window allows flexibility in various soldering conditions.
- Clear residue minimises post-soldering cleaning requirements.
- Low voiding provides reliable and strong solder joints.
- Excellent wetting compatibility with most board finishes ensures consistent performance.
- Dispense grade formulation for precision application.
- Compatible with enclosed print heads for enhanced usability.
- Passes BONO test @ 1.56%, ensuring high-quality standards.
Technical Specifications
- Alloy: Sn96.5/Ag3/Cu0.5
- Shelf life: >6 months (refrigerated), >2 months (unrefrigerated)
- Flux Type: No Clean
- Solder Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu
- Melting Temperature: 217°C
This solder paste is perfect for both professional and hobbyist applications, offering reliability and ease of use in electronic assembly and repair.
- Shipped within 0-2 business days
- Shipping to United States: 3-5 business days*
- Free Shipping Included
- Electronic assembly
- PCB soldering
- Surface mount technology (SMT)
- Repair and rework applications
- Printing Speed: Up to 100mm/sec
- Stencil Life: Long
- Process Window: Wide
- Residue Type: Clear
- Voiding: Low
- Wetting Compatibility: Excellent on most board finishes
- Grade: Dispense
- Compatibility: Enclosed print heads
- BONO Test: Passes @ 1.56%
- Alloy: Sn96.5/Ag3/Cu0.5
- Shelf Life: >6 months (refrigerated), >2 months (unrefrigerated)
- Flux Type: No Clean
- Solder Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu
- Melting Temperature: 217°C
- Weight: 50g
Always follow local regulations and product guidance.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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