CHIP QUIK No-Clean Solder Paste Sn63/Pb37, T3 Mesh, 50g
High-performance no-clean solder paste (Sn63/Pb37) for precision soldering. Low residue, 50g jar. Ideal for PCBs.
The CHIP QUIK No-Clean Solder Paste offers professional-grade performance for soldering applications, with its Sn63/Pb37 alloy composition ensuring high reliability and excellent wetting compatibility on most board finishes. Delivered in a convenient 50g jar, this solder paste provides a wide process window and clear residue for superior results.
This dispense grade solder paste is compatible with enclosed print heads and supports printing speeds up to 100mm/sec, ensuring efficient production processes. Its low voiding and long stencil life help maintain precision in surface-mount technology (SMT) applications. Additionally, it passes the BONO test, ensuring high solder joint integrity.
Key Features
- No-clean flux type reduces post-soldering cleaning requirements
- Shelf life of >12 months (refrigerated) or >6 months (unrefrigerated) for extended usability
- Melting temperature of 183°C ensures strong bonding
- Synthetic no-clean flux minimises residue
Ideal for industrial and professional use, this solder paste ensures high-quality joints with minimal maintenance, making it a preferred choice for electronics assembly and repair.
- Shipped within 0-2 business days
- Shipping to United States: 3-5 business days*
- Free Shipping Included
- Surface-mount technology (SMT) assembly
- Electronics soldering applications
- PCB rework and repair
- Automated soldering systems
- Solder Alloy: 63/37 Sn/Pb
- Flux Type: Synthetic No Clean
- Mesh: T3
- Weight: 50g
- Melting Temperature: 183°C
- Shelf Life: >12 months (refrigerated), >6 months (unrefrigerated)
Always follow local regulations and product guidance.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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