Fischer Elektronik DIP Glue-On Heatsink, 8.5°C/W
Compact aluminium glue-on heatsink for DIP packages. 8.5°C/W thermal resistance, 43x33x15mm. For reliable component cooling.
The Fischer Elektronik DIP Glue-On Heatsink is an essential thermal management component designed to dissipate heat from integrated circuits in DIP (Dual In-line Package) formats. Crafted from high-purity aluminium, this heatsink efficiently draws heat away from sensitive components, thereby improving reliability and extending operational lifespan. Its compact, glue-on design allows for a secure and permanent attachment without the need for drilling or mechanical fasteners, making installation simple and clean.
With a thermal resistance of 8.5°C/W, this heatsink provides effective cooling performance for a range of electronic devices, helping to prevent overheating and thermal throttling. The lightweight aluminium construction ensures excellent heat conductivity while minimising added weight to the PCB assembly. Its dimensions are carefully engineered to fit standard DIP packages, offering a practical cooling solution where space is at a premium.
Key Features & Specifications
- Material: High-conductivity aluminium
- Thermal Resistance: 8.5°C/W
- Compatible Package: DIP (Dual In-line Package)
- Mounting Method: Glue-on adhesive attachment
- Height: 43 mm
- Width: 33 mm
- Depth: 15 mm
- Weight: 4 grams
This heatsink is ideal for use in prototype development, educational electronics kits, and commercial products where effective, low-profile cooling is required. By maintaining lower operating temperatures, it contributes significantly to the stability and durability of electronic circuits.
- Shipped within 0-2 business days
- Shipping to United States: 3-5 business days*
- Free Shipping Included
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Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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