
Compact HIROSE mezzanine connector socket with 0.4mm pitch & 100 contacts. Phosphor bronze SMD for high-density PCB stacking.
The HIROSE Mezzanine Connector Socket is a compact, high-density board-to-board interconnect solution designed for advanced electronic assemblies. Engineered with a precision 0.4mm pitch and configured in 2 rows to provide 100 contacts, this connector enables the reliable stacking of printed circuit boards (PCBs) in space-constrained applications.
Featuring a phosphor bronze contact material, the connector ensures excellent conductivity, durability, and long-term signal integrity. The surface-mount device (SMD) termination style facilitates efficient automated assembly processes, making it ideal for high-volume manufacturing. Its robust construction is designed to withstand the mechanical stresses of repeated mating cycles and provide a stable connection between stacked PCBs.
This connector is a critical component for creating complex, multi-board systems where real estate is at a premium. Its high-contact-density design allows for a significant number of signals and power lines to pass between boards without requiring excessive space, promoting more compact and efficient product designs. Whether for prototyping or full-scale production, this mezzanine socket offers a reliable and industry-proven interconnect method.
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