JST PUD Series Socket Contact, Crimp, 28-24 AWG, Tin Plated

The JST PUD Series Socket Contact is a crimp-type contact designed to provide a dependable fine-gauge connection for high-density board wiring. Manufactured by JST / Japan Solderless Terminals, this socket contact is specifically engineered for use with PUD housings, ensuring a secure and reliable electrical connection in compact spaces.

Designed to accommodate 28-24 AWG wire, this tin-plated contact offers excellent conductivity and resistance to corrosion, maintaining signal integrity in delicate electronic applications. The crimp termination method allows for quick and efficient assembly without the need for soldering, streamlining the production process while ensuring a strong mechanical and electrical bond.

With compact dimensions of 33 mm in height, 22 mm in width, and 2 mm in depth, this component is perfectly suited for high-density applications where space is at a premium. Weighing just 0.074 grams, it adds negligible weight to the overall assembly, making it an ideal choice for lightweight and miniaturised electronic devices.

Key Features

• Crimp type socket contact
• PUD series compatibility
• Suitable for 28-24 AWG wire
• Tin-plated for corrosion resistance and optimal conductivity
• Designed for high-density board wiring

Whether you are working on intricate circuit boards or compact electronic housings, the JST PUD socket contact provides the precision and reliability required for demanding interconnect solutions.