
Multicomp Pro 1.27mm pitch, 50-way vertical pin header for high-density PCB interconnects. Secure through-hole mounting.
The Multicomp Pro 1.27mm Pin Header is a high-density interconnect solution designed for modern, compact electronic assemblies. Featuring two rows and fifty positions at a tight 1.27mm pitch, this vertical header enables efficient connections in space-constrained applications, facilitating the integration of complex circuitry on printed circuit boards (PCBs).
Engineered for reliability, the header is constructed from durable materials to ensure stable electrical performance and robust mechanical connections. Its vertical through-hole mounting design provides a secure and permanent fixture to the PCB, enhancing the overall structural integrity of the assembly. This makes it an ideal choice for prototypes, development boards, and final production units where consistent signal integrity is paramount.
Key Features & Benefits
This component is a fundamental building block for creating reliable interconnects in a wide array of digital and embedded systems.
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