Multicomp Pro Heatsink for TO-218, TO-220, TO-247, 4.4°C/W

The Multicomp Pro Heatsink is a high-performance, vertical mounting solution engineered for efficient thermal management in demanding electronic applications. Designed for a single TO-218, TO-220, or TO-247 semiconductor package, this extruded aluminium heatsink features a black anodised finish for both corrosion resistance and an enhanced aesthetic. Its notched base design ensures optimal airflow and surface contact, while the solderable mounting pins provide a secure and permanent method of attachment to printed circuit boards.

This heatsink is pre-drilled with mounting holes, offering flexibility for secure through-hole installation. Its low thermal resistance of 4.4°C/W ensures effective heat dissipation, helping to maintain component reliability and extend operational lifespan. The robust 38.1 x 25 x 42mm construction is built for high power dissipation, making it an essential component for power regulation and amplification circuits. For applications requiring additional mounting security, a compatible clip is available separately.

Key Features & Specifications

• Thermal Performance: Low thermal resistance of 4.4°C/W for efficient heat transfer.
• Mounting Design: Vertical mounting orientation with pre-drilled holes and solderable fixing pins.
• Compatibility: Specifically designed for use with TO-218, TO-220, and TO-247 semiconductor packages.
• Construction: High-quality extruded aluminium with a durable black anodised finish and a notched base.
• Dimensions: Compact size measuring 38.1mm in length, 25mm in width, and 42mm in height.

An ideal choice for industrial electronics, power supplies, audio amplifiers, and other circuits where effective cooling of power semiconductors is critical. Its reliable design ensures stable performance, helping to prevent thermal runaway and protect valuable components.