
Extruded aluminium heatsink for TO-220 packages. 8.8°C/W thermal resistance, vertical mounting, black anodized. 50mm height, solderable pins.
The Multicomp Pro MC33290 extruded heatsink is designed for efficient thermal management of TO-220 package semiconductors. Its compact, vertical-mount design and solderable fixing pins make it easy to integrate into a wide range of electronic assemblies.
This heatsink features a black anodized finish for improved heat dissipation and durability. Pre-drilled mounting holes simplify installation, saving time during assembly. With a thermal resistance of 8.8°C/W, it effectively draws heat away from your components, ensuring reliable operation.
Specifications:
Its compact size makes it an excellent choice for space-constrained industrial applications where efficient heat sinking is critical. Trust the quality and performance of Multicomp Pro for your thermal management needs.
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