Multicore Loctite LF318 Lead-Free Solder Paste, 500g
Lead-free, halide-free solder paste with 88.5% metal content. Ideal for PCB assembly and reflow soldering.
The Multicore Loctite LF318 Solder Paste is a high-performance, lead-free, and halide-free solution designed for precision soldering applications. This no-clean solder paste leaves minimal residues, ensuring a clean and efficient workflow. With an 88.5% metal content, it delivers superior solderability and reliability for your electronic assemblies.
Features
- Lead-free and halide-free formulation for environmental and safety compliance
- No-clean residues, reducing post-soldering cleanup
- High metal content (88.5%) ensures strong solder joints
- Suitable for reflow soldering in both air and nitrogen environments
- Alloy composition: 95.5% Tin, 3.8% Silver, 0.7% Copper (SAC 387)
- Melting point: 217°C for optimal soldering performance
Applications
- Printed Circuit Board (PCB) assembly
- Surface-mount technology (SMT) applications
- Reflow soldering processes
- Electronics manufacturing and repair
This 500g solder paste is ideal for professionals and hobbyists who require a reliable and high-quality soldering material for their projects. Its excellent thermal properties and consistency ensure smooth application and durable solder connections.
- PCB assembly
- SMT applications
- Reflow soldering
- Electronics manufacturing
- Lead-free
- Halide-free
- No-clean residues
- Metal content: 88.5%
- Suitable for reflow in air or nitrogen
- Alloy composition: 95.5% Sn, 3.8% Ag, 0.7% Cu (SAC 387)
- Melting point: 217°C
- Net weight: 500g
- Gross weight (approx.): 530g
Always follow local regulations and product guidance. Use appropriate PPE.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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