PROTO ADVANTAGE TSSOP8 to DIP8 Adapter, 0.65mm Pitch

The PROTO ADVANTAGE TSSOP8 to DIP8 Adapter is a precision-engineered solution for converting surface mount TSSOP8 packages to through-hole DIP8 format. Crafted from 1.5mm thick FR4 epoxy fibreglass with double-sided 35µm copper layers, this adapter ensures reliable signal transmission and durability.

The board features a chemical Ni/Au plated surface on both sides with solder stop masks, providing excellent solderability and protection. The top side accommodates surface mount connector footprints, while the bottom side has pads for two single row surface mount vertical headers, offering flexibility in your prototyping or production setup.

Key Features:

• 1.5mm thick FR4 epoxy fibreglass construction
• Double-sided 35µm copper layers with Ni/Au plating
• Solder stop masks on both sides
• 1.0mm hole diameter for easy component insertion
• Includes PCB, surface mount pin headers and 2x assembly spacers

Ideal for:

• Prototyping TSSOP8 packages in breadboards
• Converting surface mount devices for through-hole applications
• Testing and development of TSSOP8 ICs
• Educational electronics projects

With its compact dimensions (17.78mm height × 10.16mm width) and 1.6mm board thickness, this adapter provides a neat solution for integrating surface mount components into traditional through-hole circuits.