QUALITEK Lead-Free Solder Paste, SnAgCu, 250g Pot
Lead-free solder paste (SnAgCu alloy) with no-clean flux – ideal for SMT applications, 250g pot.
The QUALITEK Lead-Free Solder Paste is a high-performance solder paste designed for surface-mount technology (SMT) applications. Formulated with a 95.5/3/0.5 Sn/Ag/Cu alloy, it provides excellent soldering performance while complying with lead-free regulations. This paste ensures a broad process window for ease of use, whether for manual or automated assembly.
The no-clean flux formulation leaves behind transparent, non-corrosive, and non-conductive residues, eliminating the need for post-soldering cleaning. Housed in a convenient 250g pot, this solder paste is ideal for SMT printing and is compatible with Type 3 MESH.
With a melting temperature range of 217°C-219°C, it delivers reliable bonding for electronic components. Perfect for professional and hobbyist applications, this solder paste combines quality, efficiency, and environmental compliance.
Key Features:
- Lead-free composition (95.5% Sn, 3% Ag, 0.5% Cu)
- No-clean flux – residue-free soldering
- Broad soldering process window
- Type 3 MESH compatibility
- Transparent, non-corrosive post-soldering residues
- Melting temperature: 217°C-219°C
- Packaged in a 250g pot
- Shipped within 0-2 business days
- Shipping to United States: 3-5 business days*
- Free Shipping Included
- Surface-mount technology (SMT) assembly
- PCB soldering
- Electronics prototyping
- SMD component soldering
- Lead-free alloy (95.5% Sn, 3% Ag, 0.5% Cu)
- No-clean flux formulation
- Type 3 MESH compatible
- Melting Temperature: 217°C-219°C
- Residues: Transparent, non-corrosive, non-conductive
- Weight: 250g (net)
Always follow local regulations and product guidance.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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