
T GLOBAL highly compressible gap filler for effective heat conduction and electrical insulation. Ideal for CPUs, LEDs, and motherboards.
The T GLOBAL Gap Filler is a highly compressible, soft material designed to provide excellent electrical insulation while ensuring efficient thermal management. Easy to assemble, this gap filler acts as an effective shock and vibration absorber, protecting sensitive components from physical stress and mechanical damage.
Ideal for use on ICs, CPUs, and MOS components, it facilitates optimal heat conduction between printed circuit boards and enclosure walls. By filling air gaps, it significantly improves thermal transfer, ensuring that heat is effectively dissipated from critical electronic parts. This helps to maintain performance and prolong the lifespan of your devices.
This versatile thermal interface material is perfectly suited for dissipating heat from a wide range of electronics, including LEDs, motherboards, power supply units (PSUs), televisions, personal computers (PCs), hubs, handsets, and memory hard drives. With a thermal conductivity of 2.2W/m.K and a Shore hardness of 10, it offers a balance of flexibility and thermal performance, conforming to uneven surfaces for maximum contact area.
Key Features
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