Warton Microprint P2010 No Clean Solder Paste, 250g
Warton Microprint P2010 lead-free solder paste for air/nitrogen reflow, 250g, 220°C melting point, and 72-hour tack life.
The Warton Microprint P2010 No Clean Solder Paste is a high-performance, lead-free solution designed for air and nitrogen reflow applications. Developed to work efficiently at higher processing temperatures required by SAC alloys, it ensures excellent soldering results across a variety of substrate materials, including Sn/Pb, Au/Ni, and OSP treat finishes.
This solder paste is halogen-free and slump-free, eliminating the risk of solder balling. Its clear probe-testable residue allows for easy inspection post-soldering. With a tack life of 72 hours and a 12-month refrigerated shelf life (when stored below 10°C), this solder paste offers both reliability and longevity.
Key Features
- Fast Printing: Suitable for speeds of 20-100mm/sec.
- No Clean: Complies with ROM0 (J-STD-004) standards.
- Flux Type: No Clean.
- Solder Alloy: 96.5% Sn, 3% Ag, 0.5% Cu.
- Melting Temperature: 220°C.
- Weight: 250g.
Ideal for professional electronics manufacturing, the Warton Microprint P2010 ensures consistent, high-quality soldering results, making it a trusted choice for demanding applications.
- Electronics manufacturing
- Reflow soldering applications
- Assembly of Sn/Pb, Au/Ni, and OSP treat finishes
- Halogen Free
- Slump-free, no solder balling
- Suitable for air/nitrogen
- Clear probe testable residue
- Excellent soldering, 72-hour tack life
- 12-months refrigerated shelf life (stored at <10°C)
- Fast print: 20-100mm/sec
- No clean: ROM0 (J-STD-004)
- Flux Type: No Clean
- Solder Alloy: 96.5, 3, 0.5 Sn, Ag, Cu
- Melting Temperature: 220°C
- Weight: 250g
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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