ABL HEATSINKS 520AB1000MB TO3 Aluminium Heat Sink 100 x 88 x 35mm

The ABL HEATSINKS 520AB1000MB is a precision-engineered heat sink designed for effective thermal management of TO-3 package devices. Manufactured from high-quality aluminium with an anodised finish, this heat sink offers excellent heat dissipation and corrosion resistance, ensuring reliable performance in demanding industrial environments.

With dimensions of 100 x 88 x 35mm and a drilled hole configuration, the heat sink is ready for direct mounting. The vertical mount design facilitates optimal airflow, enhancing cooling efficiency for your semiconductor components. It provides a low thermal resistance of 1.4°C/W, ensuring efficient heat transfer from the device to the surrounding air.

Key Features

• Designed for use with TO-3 devices
• Aluminium construction for lightweight durability
• Anodised finish for improved corrosion resistance
• Drilled holes for easy installation
• Vertical mount orientation for space-saving setups

Applications

This heat sink is ideal for industrial applications where reliable thermal management is critical. It is suitable for cooling TO-3 transistors and other similar semiconductor packages, helping to maintain optimal operating temperatures and prolonging the lifespan of your components.

Package Contents

• 1 x Heat Sink