HARWIN 2-Row Header, 36+36 Way, 2.54mm Pitch
Durable HARWIN 2-row pin header (36+36 way) for industrial & board-to-board applications. Gold/tin plating.
The HARWIN M20-998 series features a robust 2.54mm pitch, double-row DIL vertical PC tail pin header, designed for reliable connectivity in industrial and board-to-board applications. With a mating height of 6.1mm, this header ensures secure and stable connections for various electronic setups.
Key Features
- Durability: Built for high-performance environments with a brass contact material and choice of gold or tin over nickel plating for reliable conductivity.
- High Temperature Resistance: UL94 V-0 flame-retardant, black-coloured high-temperature polyamide (Nylon) 6T moulding ensures thermal stability.
- Electrical Performance: Rated for 3A maximum current with low contact resistance (25mΩ gold, 30mΩ tin).
- Wide Temperature Range: Operational from -40°C to 105°C, making it suitable for demanding conditions.
Applications
- Industrial electronics
- Board-to-board connection systems
Specifications
- Pitch Spacing: 2.54mm
- Number of Rows: 2 Rows
- Number of Contacts: 72 (36+36 way)
- Contact Termination: Through-hole, straight
- Connector Shroud: Unshrouded
- Dielectric Strength: 750V AC/DC
Whether for prototyping or production, the HARWIN 2-Row Header provides a dependable and high-performance solution.
- Pitch: 2.54mm
- Mating Height: 6.1mm
- Contacts per Row: 2 to 40
- Finish Options: Gold or Tin over Nickel
- Contact Material: Brass
- Housing Material: UL94 V-0 Nylon 6T
- Current Rating: 3A max
- Contact Resistance: Gold 25mΩ / Tin 30mΩ
- Operating Temperature: -40°C to 105°C
- Durability: Gold 300 ops / Tin 50 ops
- Dielectric Strength: 750V AC/DC
- Termination: Through Hole Straight
- Connector Range: M20 Series
Free standard delivery on UK mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
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