Molex / Brad Micro-Fit 3.0 Socket Crimp Contact 20 AWG Tin Plated

The Molex / Brad Micro-Fit 3.0 Socket Crimp Contact is a compact power contact meticulously designed for reliable wire-to-board connections. Engineered specifically for 20 AWG wire, this tin-plated socket contact ensures excellent electrical conductivity and secure terminations within the Micro-Fit 3.0 connector system.

Ideal for applications requiring space-saving power delivery, the contact provides a highly robust crimp connection. Its tin-plated surface significantly enhances durability and offers resistance to environmental factors, maintaining a stable electrical connection over extended periods of use. The compact design allows for high-density configurations, making it perfectly suited for modern electronic assemblies where space is at a premium.

Key Specifications

• Series: Micro-Fit 3.0
• Contact Type: Socket
• Termination Method: Crimp
• Wire Size Compatibility: 20 AWG
• Plating: Tin
• Height: 33 mm
• Width: 22 mm
• Depth: 2 mm
• Weight: 1.216 grams

Whether you are manufacturing or repairing wire-to-board harnesses, this Micro-Fit 3.0 crimp contact is an essential component for ensuring precise and effective electrical pathways in your electronic projects.