MOLEX C-Grid III 18-Way 2-Row Vertical PCB Header

The MOLEX C-Grid III 2.54mm PCB Header is a key component within a versatile, modular interconnection system designed for maximum design flexibility in electronic packaging. This vertical, 18-way, 2-row header forms reliable wire-to-board and board-to-board connections, offering engineers a wide range of alternatives for their circuit designs.

Crafted for robust performance, the header features brass contacts with a gold plating for superior conductivity and corrosion resistance. Its through-hole, straight termination ensures a secure and permanent solder connection to the printed circuit board. The fully shrouded design provides essential polarisation and protection for the mating pins, preventing misalignment and potential damage during assembly.

A significant advantage of this system is its full compatibility with the industry-standard DIN41651 specification and interchangeability with Molex's own QF-50 product family, ensuring broad applicability and ease of sourcing. The header is designed to accept both discrete wire connectors and ribbon cable connectors, providing excellent versatility for different cabling requirements. Furthermore, the materials and construction meet stringent glow wire requirements, an important safety standard for components used in various electronic applications.

Key Features & Specifications

• Pitch Spacing: 2.54mm standard spacing for reliable connections.
• Contact Configuration: 18 contacts arranged in 2 rows for a compact, high-density layout.
• Termination: Through-hole, straight pin design for robust PCB mounting.
• Contact Material: Brass with gold-plated contacts ensures excellent electrical performance and durability.
• Shroud: Fully shrouded connector body for safe mating and polarisation.
• Modularity: Part of the flexible C-Grid III (90130 series) interconnect system.
• Dimensions: Compact profile at