
Reliable Molex iGrid 501647 socket crimp contact for 22 AWG wire, tin plated for secure wire-to-board connections.
The Molex iGrid 501647 socket crimp contact is designed for reliable wire-to-board connections. This contact is suitable for 22 AWG wire and features tin-plated construction, ensuring good conductivity and corrosion resistance.
This socket contact provides a secure and dependable crimp termination within iGrid connector housings. The tin plating offers a cost-effective solution for applications where durability and consistent electrical performance are required.
Key Features
Ideal for use in a variety of electronic devices and systems, this Molex contact is a dependable choice for your wire-to-board interconnection needs.
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