Multicomp Pro Heat Sink, 3.3°C/W for TO-218, TO-220, TO-247

The Multicomp Pro Heat Sink is a vertical mounting, extruded aluminium solution designed for high-power dissipation in a compact form factor. Measuring 50.8 x 25 x 42 mm, it features a black anodized finish for durability and corrosion resistance, along with solderable fixing pins for secure electrical and mechanical attachment. The notched base design enhances stability and thermal contact with the device being cooled.

Engineered with a low thermal resistance of 3.3°C/W, this heatsink efficiently draws heat away from sensitive semiconductor packages, including TO-218, TO-220, and TO-247 devices. It can be mounted directly through its pre-drilled mounting holes or used with a separate clip for additional security. The combination of solderable pins and mounting holes provides versatile installation options for various PCB layouts and assembly processes.

Ideal for demanding industrial environments, this heatsink is a reliable component for power management circuits, motor drives, and amplifier modules where effective thermal management is critical for performance and longevity. Its robust construction ensures consistent operation under continuous load, making it a practical choice for engineers and hobbyists alike.

Key Specifications

• Thermal Resistance: 3.3°C/W
• Compatible Packages: TO-218, TO-220, TO-247
• Mounting Style: Vertical
• Finish: Black Anodized
• Construction: Extruded Aluminium
• Features: Solderable pins, notched base, pre-drilled mounting holes
• Dimensions (L x W x H): 50.8mm x 25mm x 42mm