WARTON Microprint P2010 No Clean, Lead-Free Solder Paste, 40g Syringe

The WARTON Microprint P2010 is a high-performance, lead-free solder paste designed for both air and nitrogen reflow applications. Developed to withstand higher processing temperatures typical of SAC alloys, this solder paste ensures robust and reliable joints across various substrate materials, including Sn/Pb, Au/Ni, and OSP-treated finishes.

This halogen-free solder paste offers slump-free performance and eliminates solder balling, making it ideal for precision applications. The residue is clear and probe-testable, ensuring ease of inspection after soldering. With an excellent tack life of 72 hours and a refrigerated shelf life of 12 months (when stored below 10°C), it provides long-term usability and reliability.

Key Features:

• Fast print speed (20-100mm/sec) for efficient production workflows.
• No-clean formulation (ROM0 per J-STD-004) reduces post-soldering cleanup.
• Flux Type: No Clean.
• Solder Alloy: 96.5% Sn, 3% Ag, 0.5% Cu.
• Melting temperature: 220°C.

Ideal for high-reliability electronics manufacturing, the WARTON Microprint P2010 delivers exceptional soldering performance with minimal residue, ensuring clean and efficient assembly processes.