CHIP QUIK No-Clean Lead-Free Solder Paste, Sn96.5/Ag3/Cu0.5, 250g
CHIP QUIK
Premium no-clean lead-free solder paste (Sn96.5/Ag3/Cu0.5) for PCB assembly. 250g jar, T3 mesh, 220°C melting point.
Soldering, Desoldering & ReworkTowing & Trailer AccessoriesFixing Bands, Straps & Wall Ties +21
250gSMTPCB AssemblyReflow +6